nach oben

Physics of Metals and Metallography

Erschienen in:

29.12.2023 | STRENGTH AND PLASTICITY

The Influence of Nickel Addition on Properties of Sn–4.0Zn–0.7Cu Lead-Free Solder

verfasst von: Panisara Sukhontapatipak, Phairote Sungkhaphaitoon

Erschienen in: Physics of Metals and Metallography | Ausgabe 13/2023

Einloggen

Aktivieren Sie unsere intelligente Suche, um passende Fachinhalte oder Patente zu finden.

search-config

KI-gestützte Suche

Aus

Abstract

This research investigated changes in the properties of Sn–4.0Zn–0.7Cu (SZC407) solder alloy after doping with 0.5 wt % Ni. Specimens of SZC407 and SZC407–0.5Ni solder alloys were characterized in terms of chemical composition, microstructure, mechanical properties, and melting point. The results showed that the addition 0.5 wt % Ni had no significant effect on the ultimate tensile strength and elongation of SZC407 solder alloy but the formation of phases of the intermetallic compound (IMC) CuZnNi in the solder matrix increased the microhardness of the alloy. These IMC phases improved the strength of the solder matrix by the dispersion strengthening mechanism. The fracture surface of both solder alloys was typical of the ductile fracture mode. The microstructure of the solder alloy was improved by the distribution in the solder matrix of new CuZnNi IMC phases. However, the addition of 0.5 wt % Ni slightly increased the solidus and liquidus temperatures, pasty range and peak temperature of the SZC407 solder alloy.

Vorheriger Artikel Research on the Choice of Cooling Method for a Rare-Earth Wrought Magnesium Alloy Considering Temperature Distribution, Hardness and Microstructure

Nächster Artikel Investigation of the Effects of Sandblasting, Acid Etching, and Anodizing Parameters in the SLA + Anodizing on the Surface Treatment of Titanium Dental Implant Fixtures

Sie haben noch keine Lizenz? Dann Informieren Sie sich jetzt über unsere Produkte:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

über 102.000 Bücher
über 537 Zeitschriften

aus folgenden Fachgebieten:

Automobil + Motoren
Bauwesen + Immobilien
Business IT + Informatik
Elektrotechnik + Elektronik
Energie + Nachhaltigkeit
Finance + Banking
Management + Führung
Marketing + Vertrieb
Maschinenbau + Werkstoffe
Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Jetzt informieren

Springer Professional "Wirtschaft"

Online-Abonnement

Mit Springer Professional "Wirtschaft" erhalten Sie Zugriff auf:

über 67.000 Bücher
über 340 Zeitschriften

aus folgenden Fachgebieten:

Bauwesen + Immobilien
Business IT + Informatik
Finance + Banking
Management + Führung
Marketing + Vertrieb
Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Jetzt informieren

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

über 67.000 Bücher
über 390 Zeitschriften

aus folgenden Fachgebieten:

Automobil + Motoren
Bauwesen + Immobilien
Business IT + Informatik
Elektrotechnik + Elektronik
Energie + Nachhaltigkeit
Maschinenbau + Werkstoffe

Jetzt Wissensvorsprung sichern!

Jetzt informieren

K. Suganuma, “Advances in lead-free electronics soldering,” Curr. Opin. Solid State Mater. Sci. 5, 55–64 (2001). https://doi.org/10.1016/S13590286(00)00036-XADSCrossRef

A. E. Hammad, “Investigation of microstructure and mechanical properties of novel Sn0.5Ag0.7Cu solders containing small amount of Ni,” Mater. Des. 50, 108–116 (2013). https://doi.org/10.1016/j.matdes.2013.03.010CrossRef

A. A. El-Daly and A. E. Hammad, “Development of high strength Sn0.7Cu solders with the addition of small amount of Ag and In,” J. Alloys Compd. 509, 8554–8560 (2011). https://doi.org/10.1016/j.jallcom.2011.05.119CrossRef

H. R. Kotadia, O. Mokhtari, M. P. Clode, M. A. Green, and S. H. Mannan, “Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and NiP substrates,” J. Alloys Compd. 511, 176–188 (2012). https://doi.org/10.1016/j.jallcom.2011.09.024CrossRef

S. Y. Chang, C. C. Jain, T. H. Chuang, L. P. Feng, and L. C. Tsao, “Effect of addition of TiO₂ nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder,” Mater. Des. 32, 4720–4727 (2011). https://doi.org/10.1016/j.matdes.2011.06.044CrossRef

H. Kang, M. Lee, D. Sun, S. Pae, and J. Park, “Formation of octahedral corrosion products in Sn–Ag flip chip solder bump,” Scr. Mater. 108, 126–129 (2015). https://doi.org/10.1016/j.scriptamat.2015.06.034CrossRef

S. H. Huh, K. S. Kim, and K. Suganuma, “Effect of Ag addition on the microstructural and mechanical properties of Sn–Cu eutectic solder,” Mater. Trans. 42, 739–744 (2001). https://doi.org/10.2320/matertrans.42.739CrossRef

M. Date, K. N. Tu, T. Shoji, M. Fujiyoshi, and K. Sato, “Interfacial reactions and impact reliability of Sn–Zn solder joints on Cu or electroless Au/Ni(P) bond-pads,” J. Mater. Res. 19, 2887–2896 (2004). https://doi.org/10.1557/JMR.2004.0371ADSCrossRef

S. H. Chang and S. K. Wu, “Damping characteristics of Sn–3Ag–0.5Cu and Sn–37Pb solders studied by dynamic mechanical analysis,” Scr. Mater. 63, 957–960 (2010). https://doi.org/10.1016/j.scriptamat.2010.07.004ADSCrossRef

10.

C. Y. Chou and S. W. Chen, “Phase equilibria of the Sn–Zn–Cu ternary system,” Acta Mater. 54, 2393–2400 (2006). https://doi.org/10.1016/j.actamat.2006.01.014ADSCrossRef

11.

K. Suganuma and K. S. Kim, “Sn–Zn low temperature solder,” J. Mater. Sci.: Mater. Electron. 18, 121–127 (2007). https://doi.org/10.1007/978-0-387-48433-4_7CrossRef

12.

M. Yamaguchi, T. Ichitsubo, E. Matsubara, H. Kimura, K. Sasamori, H. Irie, S. Kumamoto, and T. Anada, “Atomizing effect on Sn–Zn based solder alloy,” J. Jpn. Inst. Met. 70, 162–165 (2006). https://doi.org/10.2320/jinstmet.70.162CrossRef

13.

Y. S. Kim, K. S. Kim, C. W. Hwang, and K. Suganuma, “Effect of composition and cooling rate on microstructure and tensile properties of Sn–Zn–Bi alloys,” J. Alloys Compd. 352, 237–245 (2003). https://doi.org/10.1016/S0925-8388(02)01168-4CrossRef

14.

J. M. Song and K. L. Lin, “Behavior of intermetallics in liquid Sn–Zn–Ag solder alloys,” J. Mater. Res. 18, 2060–2067 (2003). https://doi.org/10.1557/JMR.2003.0290ADSCrossRef

15.

K. L. Lin and H. M. Hsu, “Sn–Zn–Al Pb-free solder—An inherent barrier solder for Cu contact,” J. Electron. Mater. 30, 1068–1072 (2001). https://doi.org/10.1007/s11664-001-0131-yADSCrossRef

16.

D. Q. Yu, H. P. Xie, and L. Wang, “Investigation of interfacial microstructure and wetting property of newly developed Sn–Zn–Cu solders with Cu substrate,” J. Alloys Compd. 385, 119–125 (2004). https://doi.org/10.1016/j.jallcom.2004.04.129CrossRef

17.

J. E. Lee, K. S. Kim, M. Inoue, J. Jiang, and K. Suganuma, “Effects of Ag and Cu addition on microstructural properties and oxidation resistance of Sn‒Zn eutectic alloy,” J. Alloys Compd. 454, 310–320 (2008). https://doi.org/10.1016/j.jallcom.2006.12.037CrossRef

18.

A. A. El-Daly, A. E. Hammad, A. Fawzy, and D. A. Nasrallh, “Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions,” Mater. Des. 43, 40–49 (2013). https://doi.org/10.1016/j.matdes.2012.06.058CrossRef

19.

C. H. Wang and H. T. Shen, “Effects of Ni addition on the interfacial reaction between Sn–Cu solders and Ni substrate,” Intermetallics 18, 616–622 (2010). https://doi.org/10.1016/j.intermet.2009.10.018CrossRef

20.

A. K. Gain and Y. C. Chan, “The influence of a small amount of Al and Ni nano-particles on the microstructure, kinetic and hardness of Sn–Ag–Cu solder on OSP-Cu pads,” Intermetallics 29, 48–55 (2012). https://doi.org/10.1016/j.intermet.2012.04.019CrossRef

21.

F. X. Che, W. H. Zhu, S. W. P. Edith, X. W. Zhang, and X. R. Zhang, “The study of mechanical properties of Sn–Ag–Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures,” J. Alloys Compd. 507, 215–224 (2010). https://doi.org/10.1016/j.jallcom.2010.07.160CrossRef

22.

H. Ma, H. Xie, and L. Wang, “Effect of a trace of Bi and Ni on the microstructure and wetting properties of Sn–Zn–Cu lead-free solder,” J. Mater. Sci. Technol. 23, 81–84 (2007).

23.

Y. Lai, X. Hu, X. Jiang, and Y. Li, “Effect of Ni addition to Sn–0.7Cu solder alloy on thermal behavior, microstructure, and mechanical properties,” J. Mater. Eng. Perform. 27, 6564–6576 (2018). https://doi.org/10.1007/s11665-018-3734-7CrossRef

24.

A. A. El-Daly and A. M. El-Taher, “Improved strength of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solder alloys under controlled processing parameters,” Mater. Des. 47, 607–641 (2013). https://doi.org/10.1016/j.matdes.2012.12.081CrossRef

25.

A. E. Hammad, “Evolution of microstructure, thermal and creep properties of Ni-doped Sn–0.5Ag–0.7Cu low-Ag solder alloys for electronic applications,” Mater. Des. 52, 663–670 (2013). https://doi.org/10.1016/j.matdes.2013.05.102MathSciNetCrossRef

Titel: The Influence of Nickel Addition on Properties of Sn–4.0Zn–0.7Cu Lead-Free Solder
verfasst von: Panisara Sukhontapatipak
Phairote Sungkhaphaitoon
Publikationsdatum: 29.12.2023
Verlag: Pleiades Publishing
Erschienen in: Physics of Metals and Metallography / Ausgabe 13/2023
Print ISSN: 0031-918X
Elektronische ISSN: 1555-6190
DOI: https://doi.org/10.1134/S0031918X23600082

Springer Professional

Abstract

Bitte loggen Sie sich ein, um Zugang zu Ihrer Lizenz zu erhalten.

Sie haben noch keine Lizenz? Dann Informieren Sie sich jetzt über unsere Produkte:

Springer Professional "Wirtschaft+Technik"

Springer Professional "Wirtschaft"

Springer Professional "Technik"

Weitere Artikel der Ausgabe 13/2023

Effect of Cold-Drawing Deformation on the Microstructure and Properties of AA2024-T8

Effect of Mg Content Change on the Production of Closed-Cell Aluminum Alloy Foam by Selective Laser Melting

Effect of Nb Doping on Thermoelectric Properties of TiNiSn Half-Heusler Alloy Prepared by Microwave Method

Study on Nucleation and Growth of Columnar Grains in Non-Oriented Steel by Phase Transformation

An Atomistic Structure of Cementite (M3C, M = Fe, Cr, Mn) in Carbon Steel

Evaluating the Spatial and Size Distributions of Flat Precipitates in Diffusion-Controlled Precipitation Processes