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2024 | OriginalPaper | Buchkapitel

Photonic Integration Advancements in Miniaturizing High Reliability LIDAR System Components

verfasst von : Jes Sherman, Steven Estrella, Victoria Rosborough, Jenna Campbell, Michelle Labrecque, Brandon Isaac, Jason Seifter, Hannah Grant, Juergen Musolf, Don Kebort, Ruby Gans, Sabrina Wagner, Amin Nehrir, Gordon Morrison, Leif Johansson, Milan Mashanovich

Erschienen in: Space-based Lidar Remote Sensing Techniques and Emerging Technologies

Verlag: Springer Nature Switzerland

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Abstract

Developing space-borne LIDAR for small satellite platforms requires miniaturization, ruggedization and high reliability of optoelectronic components. Lower size, weight and power (SWaP) LIDAR systems are achievable using monolithic photonic integrated circuit (PIC) platforms, hybrid photonic integration, and advanced photonic and electronic module packaging. Freedom Photonics’ monolithic InP PIC platforms, at wavelengths from 1250 to 1800+ nm, can integrate tunable lasers, amplifiers, modulators, detectors and more, in a chip with <1 cm2 footprint. Our photonic wirebonding capabilities enable integration of aura amplifiers, boosting output power to >1 W. High sensitivity avalanche photodetectors facilitate longer range detection, and high speed photodetectors can be used for offset locking. Additional capabilities are added by our InstaTune laser control module supporting wavelength stepping and stabilization within 200 ns. Proving in the reliability of these components, particularly transmitter PICs, high power amplifiers and photonic wirebonds, is currently a major effort at Freedom Photonics, with promising preliminary results.

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Metadaten
Titel
Photonic Integration Advancements in Miniaturizing High Reliability LIDAR System Components
verfasst von
Jes Sherman
Steven Estrella
Victoria Rosborough
Jenna Campbell
Michelle Labrecque
Brandon Isaac
Jason Seifter
Hannah Grant
Juergen Musolf
Don Kebort
Ruby Gans
Sabrina Wagner
Amin Nehrir
Gordon Morrison
Leif Johansson
Milan Mashanovich
Copyright-Jahr
2024
DOI
https://doi.org/10.1007/978-3-031-53618-2_19

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