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Erschienen in:
2024 | OriginalPaper | Buchkapitel
Advancing Plating Efficiency with Simulation Technology
verfasst von : Klaus Schmid
Erschienen in: Proceedings of the 3rd International Conference on Advanced Surface Enhancement (INCASE) 2023
Verlag: Springer Nature Singapore
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Abstract
Powerful tools for improving the layer thickness distribution in electroplating are available through simulation techniques for calculating the electric field. To get the best out of these simulation technologies, a good knowledge of the possibilities of simulation tools, the needed requirements as well as typical, proven workflows are important. This paper uses an industrial case study to cover, present and discuss the above-mentioned points as well as the used approach used and the achieved results. Both the individual results achieved and the improved understanding of the process noticeably improve the efficiency in electroplating.